About

The workshop on advanced wood technology is intended to provide a forum for scientists, engineers, and industry representatives, and community stakeholders working in field of wood nanoscience and nanotechnologies to communicate the latest research and exchange ideas about next-generation solutions.
There are three trillion mature trees on Earth, which translates to over 400 trees per person. In this workshop, we will discuss high-end potentials of an abundant material with applications in the areas of energy, water, membrane, lightweight structural materials, 'green' buildings, acoustics, battery and fuel cells, combustions, catalysts, and more!
Topics to be addressed:
Wood Nanocellulose and Wood-Based Nanomaterials: wood nanocellulose materials, production, characterization, lignin, other bio-materials, hierarchical structures
Fundamental Science:  mechanical/thermal/ optical/barrier properties, advanced characterization techniques, multi-scale modeling
Functional Structures & Manufacturing: 
multifunctional composites, functionalization, lightweight and strong composites, transparent substrates, 3D aerogel, hydrogel, nanomanufacturing
Emerging Applications: ​buildings, energy-water devices, lightweight structural materials, flexible/biodegradable electronics, optics, optoelectronics
A. James Clark Hall Forum (AJC1101) 
​College Park, MD 20742 
Local Organizing Committee
Liangbing Hu, Teng Li
binghu@umd.edu
lit@umd.edu
Goal

We encourage participants to network and cultivate potential collaborations for future technology research! And to use this opportunity to explore federal, state, and/or industrial funding opportunities!
Attendees
Universities: University of Maryland, Florida International University, Howard University, MIT, North Carolina State University, Princeton University, UC Merced, Virginia Tech 
National Labs & Govt Agencies: NSF, DOE ARPA-E, NIST, USDA, USDA Forest Product Lab, MD Dept. of the Environment, MD Dept. of Commerce
Industries: AHF Products, Armstrong World Industries, DuPont Electronics & Imaging, Firmenich, FiberLean Technologies Ltd., Gryphin Elements, InventWood, Sappi
Acknowledgements

Many thanks to all funding and staff support provided by the Departments of Materials Science and Engineering and Mechanical Engineering, the A. James Clark School of Engineering, and the Division of Research at the University of Maryland.
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